1 History

2 Stuff Happens B.C. 30,000-17,000 Paintings of animals made incaves by Stone Age artists Ur of the Chaldeans; occupied before 3000 Pyramids of Gizeh, near Cairo, erected Stonehenge, Salisbury Plain, England; Stone Age circle of stones 1800 Babylonian King Hammurabi’s code of laws set in stone 1450 Mycenaeans wrote in Linear Script B on clay tablets 1200 Fall of Troy Sennacherib built up Nineveh Athen’s Golden Age 100 First of Dead Sea Scrolls - Biblical manuscripts - written A.D. Burial of Saxon ship and treasure at Sutton Hoo

3 Some Time Later... A few centuries, wars, famines, kings, queens, caesars, czars and presidents later the industrial revolution began to change our lives Bicycles, automobiles, trains and airplanes began to change our lives even more A device or system that is capable of carrying out a sequence of operations in a distinctly and explicitly defined manner was created to change our lives in ways never imagined

4 History Tree branches to the corporate family treeE. Remington and Sons, founded in 1873 Sperry Gyroscope Company, founded in 1910 American Arithmometer Company, founded in 1886

5 The E. Remington Branch 1865 1875 1900 1925 1950 1975 2000 E. Remington & Sons 1873 Corp. Rand Kardex 1912 Remington Typewriter Company Remington Rand Corporation 1927

6 The Entrance of Eckert-Mauchly Corporation1865 1875 1900 1925 1950 1975 2000 1873 E. Remington & Sons Corp. Rand Kardex Remington Typewriter Company 1912 Remington Rand Corporation 1927 Delivery of UNIVAC I 1950 Eckert — Mauchly Corp. 1947

7 The Entrance of ERA 1865 1875 1900 1925 1950 1975 2000 1873 E. Remington & Sons Corp. Rand Kardex Remington Typewriter Company 1912 Remington Rand Corporation 1927 Engineering Research Associates 1946 Eckert — Mauchly Corp. 1947

8 The Sperry Gyroscope Branch1865 1875 1900 1925 1950 1975 2000 Sperry 1910 Gyroscope Company 1933 Sperry Corp.

9 The Formation of Sperry Rand Corporation1865 1875 1900 1925 1950 1975 2000 1873 E. Remington & Sons Corp. Rand Kardex Sperry 1910 Gyroscope Company Remington Typewriter Company 1912 1933 Sperry Corp. Remington Rand Corporation 1927 Engineering Research Associates 1946 1950 Eckert — Mauchly Corp. 1947 1952 Sperry Rand Corporation 1955

10 The Formation of Univac1865 1875 1900 1925 1950 1975 2000 1873 E. Remington & Sons 1910 Sperry Gyroscope Company Corp. Rand Kardex Remington Typewriter Company 1912 1933 Sperry Corp. Remington Rand Corporation 1927 Engineering Research Associates 1946 1950 Eckert — Mauchly Corp. 1947 1952 UNIVAC Division, Sperry Rand Corporation 1955

11 The Name Change to Sperry Univac1865 1875 1900 1925 1950 1975 2000 E. Remington & Sons 1873 Corp. Rand Kardex Sperry 1910 Gyroscope Company Remington Typewriter Company 1912 Sperry Corp. 1933 Remington Rand Corporation 1927 1950 Engineering Research Associates 1946 1947 Eckert — Mauchly Corp. 1952 1955 UNIVAC Division, Sperry Rand Corporation Sperry Univac 1973

12 The Name Change to Sperry Corp.1865 1875 1900 1925 1950 1975 2000 E. Remington & Sons 1873 Corp. Rand Kardex Sperry 1910 Gyroscope Company Remington Typewriter Company 1912 Remington Rand Corporation 1927 1950 Engineering Research Associates 1946 1947 Eckert — Mauchly Corp. 1952 1955 UNIVAC Division, Sperry Rand Corporation Sperry Univac 1973 Sperry 1983

13 The American Arithmometer Branch1865 1875 1900 1925 1950 1975 2000 American Arithmometer Company 1886 1905 Burroughs Adding Machine Company

14 The Formation of Unisys1865 1875 1900 1925 1950 1975 2000 E. Remington & Sons 1873 American Arithmometer Company 1886 Remington Typewriter Company 1912 Sperry 1910 Gyroscope Company Corp. Rand Kardex 1905 Burroughs Adding Machine Company Remington Rand Corporation 1927 Engineering Research Associates 1946 Eckert — Mauchly Corp. 1947 1950 1952 UNIVAC Division, Sperry Rand Corporation 1955 Sperry Univac 1973 Sperry 1983 Unisys 1986

15 1100/2200 Evolution Unisys SPERRY Sperry Univac Sperry Rand RemingtonERA 2200/400 2200/600 1100/ /200 XPC /80 System /500 / /900

16 1100 System Timeline 1947 — ERA starts work on Task 131950 — Atlas I delivered to Navy 1951 — bits, 16K, drum memory 1953 — bits, 8K, core memory 1957 — 1105 faster, 12K, core memory 1961 — K thin film registers, two banks 1965 — K core memory, guard mode 1968 — 1108A 262K memory, multiprocessing 1969 — 1106 slowed down 1108A 1972 — K plated wire, 1M extended storage, 6 processors 1975 — 1100/20, 1100/40 semiconductor memory 1977 — 1100/80 4M memory, cache 1979 — 1100/60 extended instruction set 1981 — 1100/70 1 cabinet 1100/60

17 1100 System Timeline C-Series Architecture1984 — 1100/90, System-11 extended mode, 16 M memory 1987 — 2200/200 VLSI 1100 chip set 1988 — 2200/600 new IP and memory for 1100/90 1989 — 2200/400 common I/O system

18 1100 System Timeline M-Series Architecture1990 — 2200/100 smaller/200, 2200/600ES new IO 1992 — 2200/900 paging, 1GW memory, 8 IPs 1993 — 2200/900E entry level 2200/900, 2200/500 mid-level, rack mount, 2200/900 commonality XPC data acceleration 1994 — 2200/500E, 2200/500SE, 2200/500M and 2200/500ME extensions of 2200/500 product range 1995 — 2200/300 entry level system, 2200/700 high mid-range

19 Technology

20 1940s ERA Atlas I U.S. Navy Task 13 started August, CPU1947 delivered in 1950 CPU 24-bit word 5 microsecond integer add + memory access

21 1940s ERA Atlas I , (cont’d) Memory Technology 16K word magnetic drum,000 microsecond access time Technology 2,695 vacuum tubes (18 types) 2,385 diodes

22 1950s 1101 Commercial version of Atlas I First “1100”Task 13 = 1101 binary 24 bit word Vacuum tube amplifiers

23 1950s 1101 Crystal diode logic Magnetic drum memory Input - paper tapeOutput - paper tape and typewriter

24 1950s 1103 36 bit word First commercial use of “1100”3,900 tubes, 5,000 diodes 16K word drum memory 1K word electrostatic storage tube - first five units

25 1950s 1103 1K core memory - next four units 4K core memory (1103A)420 tubes, 2,2000 diodes 12 microsecond cycle time

26 1960s 1107 Transistor/diode logic 80 nanosecond logic gateWire wrap backpanel 65K word core memory 4 microsecond cycle Magnetic film memory words Original General Register Set (GRS) 0.6 microsecond cycle

27 1960s 1108 High-end system Multiprocessor organizationImproved transistor/diode logic circuit 15 nanocsecond logic gate Four to five times 1107 performance

28 1960s 1108 One bit integrated circuit chipReplaced magnetic film memory 0.125 microsecond cycle time 64K word core memory cabinet 0.75 microsecond cycle time 256K word maximum on system

29 1960s 1106 Mid-level system Slower version processor of 1108Cost reduced 1.5 microsecond core memory

30 1970s 1110 1108 follow-on Integrated circuit logic10 nanosecond gate switching delay 12 or 14 integrated circuit board layers Two level memory

31 1970s 1110 Cost reduced core memory Plated wire memory300 nanosecond read cycle Separate I/O cabinet

32 1970s /40 Upgraded 1110 system Metal Oxide Semiconductor (MOS) memory replaces core and plated wire memory

33 1970s 1100/80 1110 follow-on Emitter Coupled Logic (ECL)3 nanosecond logic gate Precision multilayer printed circuit cards Multilayer backpanels

34 1970s 1100/80 Cache memory organization All semiconductor memory4K: 16K bit chips Two million words per cabinet

35 1970s 1100/60 and 1100/70 1106 follow-on Multimicroproccessor CPUMicroprogrammed logic 12 or 14 integrated circuit board layers

36 1970s 1110/60 and 1100/70 Single cabinet CPU, memory, I/O Greatly expanded 1100 user base Several generations of memory chips

37 1980s 1100/90 1100/80 follow-on 3.5 times performance of 1100/80LSI logic 390 picosecond gate switching delay 300 gates per chip 6000 chips per processor

38 1980s 1100/90 19 or 22 integrated circuit board layers52 integrated circuit boards per processor and cache 64K memory chips 96 I/O channels

39 1980s /90 Instruction processor, memory and I/O built in accordance with the C-Series architecture Introduced “Extended Mode” processing Foundation for the “New Programming Environment”

40 1980s 2200/200 Low-end systems CMOS - VLSI chip set One card processorSix chip, 1100 CPU 30,000 gates per chip One card processor 256K memory chip Bus and I/O modules carried over from System 11

41 1980s 2200/600 1100/90 follow-on 2+ times performance of 1100/90VLSI logic 200 picosecond gate switching delay 2000 gates per chip

42 1980s 2200/600 24 integrated circuit board layers18 integrated circuit boards per processor and cache 1 megabit memory chips (4-16MW/cabinet) 96 I/O channels

43 1980s /400 1100/60-70 follow-on 2 to 3 times performance of 1100/60 VLSI CMOS logic 5 nanosecond gate switching delay 125,000 gates per chip 2381 chips per processor

44 1980s 2200/400 12 integrated circuit board layers1 integrated circuit board per processor and cache 1 megabit memory chips (16MW max - 4MW/board) New CMOS VLSI I/O section

45 1990s 2200/100 New compact, low end system Extension of 2200/200Integrated peripherals

46 1990s 2200/600ES Extension of 2200/600 Single cabinet CPU and memoryCMOS VLSI I/O modules Less space, less power consumption

47 1990s 2200/900 2200/600 follow-on 2 times performance of 2200/600VLSI logic Multi chip RAM/gate array logic 100 picosecond gate switching delay 9000 gates per chip

48 1990s /900 197 chips per processor 50 integrated circuit board layers 1 integrated circuit board per processor and cache 1 megabit memory chips (64MW-128MW/cabinet) 384 I/O channels

49 1990s /900 Increased processing capacity with up to 8 instruction processors New second level cache (SLC) Dramatic increase in memory size - up to 512MW New System Control Facility Extended Processing Architecture providing enabling technologies for extension and growth

50 1990s /900 Instruction processor, memory and I/O built in accordance with the M-Series component of the Extended Processing Architecture Extends capabilities of “Extended Mode” processing Provision of expanded physical memory and virtually unlimited logical memory provides new paradigm for progamming

51 1990s 2200/900E Speed reduced 2200/900 Limited modelsField upgradable to 2200/900

52 1990s 2200/500 Low-end and mid-level system2 1/2 to 3 times performance of 2200/400 VLSI logic 500 picosecond gate switching delay 300,000 gates per chip, ca.100,000 used 18 chips per processor

53 1990s /500 22 board layers 1 integrated circuit board per processor and cache 1 megabit memory chips (32-128MW/cabinet) 128 I/O channels (4 cabinets)

54 1990s 2200/500 2200/900 commonality The second XPA based systemIP/SC design translated to CMOS SCSI and BMC channels System control Software The second XPA based system Successor to C Series Based on M-Series

55 1990s 2200/500 Many model ranges: UC36 Unisys common packagingEntry 2200/500SE 2200/500E 2200/500ME Midrange 2200/500 1x - 4x 2200/500M Upper Midrange 2200/500 5x - 8x UC36 Unisys common packaging 19” rack mountable components

56 1990s Extended Processing ComplexAn intelligent memory-based CEC component that connects to one or more hosts Accelerates I/O transfers Provides multi-host file-locking and communication Improves resource management

57 1990s Extended Processing ComplexMany new components Host based Data Mover (DM) XPC based Host Interface Adapter (HIA) Light pipes connecting DMs to HIAs . . . Multiple models, with optional memory sizes

58 Advances in 2200 Series Processor TechnologyYear of Intoduction Gates/Chip Gate Switching Delay Gates per Processor Chips per Processor Boards per Processor 1984 300 390 nsec 600,000 6,000 52 1989 2,000 200 psec 630,000 850 18 1992 9,000 100 psec 824,000 196 1 1993 300,000 ca. 100K used 500 psec 731,000 1100/90 2200/600 2200/900 2200/500

59 Technology Trends

60 Technology Trends Technology trends have developed from generation to generation Increase in logic density per chip Decrease in basic gate switching delay Decrease in chips per processor Increase in layers per IC board Decrease in IC boards per processor Increase in processors Increase in I/O connectivity

61 Processor Logic Gates Thousands 1,000 2200/900 800 730 2200/500 8002200/600 700 600 1100/90 500 400 1100/80 180 200 1108 40 1103 5

62 Processor Printed Circuit Cards Low - Medium Performance Systems980 1,000 800 600 400 200 1106 1100/60 System 11 2200/100 2200/400 2200/500 67 3 1

63 Processor Printed Circuit Cards High Performance Systems980 1,000 800 600 400 196 200 52 18 1 1108 1100/80 1100/90 2200/600 2200/900

64 Memory Capacity per CabinetThousands of Words 134,217 100,000 33,554 4,194 10,000 1,000 524 131 100 65 65 10 4 1 1103 1108 1106 1100/80 1100/60 1100/90 2200/600 2200/900 Core Semiconductor

65